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Hardware Engineer - High Speed Complex Hardware Design and Failure Analysis

Tcs Usa
1 day ago
Full-time
On-site
San Jose, California, United States
$130,000 - $150,000 USD yearly

Hardware Engineer - High Speed Complex Hardware Design and Failure Analysis

Must-Have Technical/Functional Skills

  • Education & Experience: B.S. or M.S. in Electrical Engineering, Computer Engineering, Materials Science,

or related field with 10+ years of progressive experience in hardware engineering, board design,

or system-level failure analysis.

  • High-Speed Hardware Expertise: Well versed in modern system architectures (PCIe Gen4/5/6,

DDR4/5, HBM, 56G/112G/224G SerDes, optical transceivers).

  • Power & Signal Integrity: Proven ability to debug complex power distribution network issues

(multi-phase VRM transient droop, PMBus/SVID telemetry, switching noise) and high-speed signal

integrity anomalies.

  • Supplier Engagement: Hands-on experience directing external silicon suppliers and analytical

laboratories through component-level physical FA.

  • Communication: Strong executive presence with proven capability to articulate complex technical

findings to cross-functional leaders and enterprise customers.

Key Responsibilities

  • Investigation Leadership: Lead end-to-end technical investigations for critical field escalations and

complex system failures spanning hardware, signal integrity, power delivery, thermal dynamics, and firmware.

  • Experimental Test Planning: Formulate structured FA hypotheses, architect fault isolation trees, and

direct lab engineers/technicians in executing test plans on high-speed boards and multi-chassis systems.

  • Multi-Domain Root Cause Analysis: Drive cross-functional root cause isolation interfacing with ASIC

Architecture, Signal Integrity (SI), Power Integrity (PI), Mechanical/Thermal, Diagnostics, and Software

engineering teams.

  • Vendor & OSAT Management: Partner with component vendors, semiconductor foundries, and packaging

houses (OSATs) to drive component-level physical FA (CSAM, X-Ray, FIB, SEM/EDX, decapsulation,

micro-probing).

  • Design Feedback (DFX): Synthesize field and manufacturing failure data to drive Design-for-Reliability

(DFR), Design-for-Debug (DFD), and Design-for-Manufacturing (DFM) requirements into next-gen hardware.

  • Mentorship & Process Excellence: Establish standardized RCFA methodologies, define best-in-class

8D report standards, and mentor junior engineers across the FA team.