GlobalFoundries is a leading full-service semiconductor foundry that provides a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. The company has a global manufacturing footprint that spans three continents, enabling it to make possible the technologies and systems that transform industries and empower customers to shape their markets. As part of our commitment to new college graduates, we offer various full-time employment paths that provide accelerated training in a fast-paced work environment, cross-functional working opportunities, and talent mobility. New college graduates will benefit from mentorship, networking, and leadership opportunities, fostering life-long connections and skills.
Responsibilities
• Drive the test development and readiness of tested device structures and defect macros to meet performance, reliability, yield, and cost objectives.
,
• Lead interactions with various engineering teams outside the immediate area, including integration, failure analysis, unit process, reliability, manufacturing, and research organizations, to facilitate and achieve program success.
,
• Develop differentiated offerings in 130nm, 90nm, and sub 90nm nodes in CMOS, SiGe, and GaN technologies targeting new and improved RF applications.
,
• Support technology development qualification milestones from conception through manufacturing installation.
,
• Support experimental design and execution, analyze experimental and performance results, including constructional analysis, and inline measurement summarization for manufacturing capability assessments and defect level assessments.
,
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Requirements
• Bachelor's in Electrical Engineering, Solid State Physics, Microelectronics, Chemical Engineering, Material Science, or related field from an accredited degree program.
,
• Fluency in English Language - written & verbal.
,
• A basic knowledge of modern semiconductor device physics and device characterization, and of semiconductor processing.
,
• Physical Capacity Demands - some amount of time required to work in a manufacturing clean room, with product handling.
,
• Proficiency in MS Office and Statistical Analysis including Cpk, Design of Experiments.
Nice-to-haves
• Prior related internship or co-op experience.
,
• Educational experience in modern device physics (FET, BJT, LDMOS, and HEMT devices, bulk and SOI device structures). Including associated electrical test and analysis methods of discrete device structures.
,
• Experience in semiconductor processing in CMOS, SiGe, and/or GaN technologies for RF applications.
,
• Experience in Analog RF technology in bipolar and/or CMOS based semiconductor technologies.
,
• A comprehensive knowledge of modern device physics (FET & BJT device, bulk & SOI device structures).
,
• Project management skills - the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
,
• Strong written and verbal communication skills.
,
• Excellent interpersonal skills; energetic, motivated, and self-driven.
,
• Demonstrated ability to work well within a global matrixed team or environment with minimal supervision.
,
• Demonstrated ability to meet deadlines and commitments.