Mechanical Hardware Engineer, Commercial Notebooks

Mechanical Hardware Engineer, Commercial Notebooks

Description -

HP is the world’s leading personal systems and printing company, we create technology that makes life better for everyone, everywhere. Our innovation springs from a team of individuals, each collaborating and contributing their own perspectives, knowledge, and experience to advance the way the world works and lives.

We are looking for visionaries, like you, who are ready to make a purposeful impact on the way the world works.

If you are our Mechanical Hardware Engineer, Commercial Notebooks in Taiwan, you will have a chance to

• Leads multiple project teams of other mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.

• Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.

• Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.

• Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities.

• Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.

• Provides guidance and mentoring to less- experienced staff members.

Are you a high-performer? We are looking for an individual with:

• Bachelor's or Master's degree in Mechanical Engineering.

• Typically 10+ years experience.

• Using ProEngineer or other 3D CAD software as a mechanical design tool.

• Excellent analytical and problem solving skills.

• Experience in mechanical and thermal architecture of electronics packaging design.

• Designing sheet metal and plastic parts and associated production tooling and processes.

• Using CFD and thermal mockups to validate thermal solution.

• Excellent written and verbal communication skills; mastery in English and local language.

• Ability to effectively communicate product architectures, design proposals and negotiate options at senior management levels.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Taiwan)

Travel -

25%

Relocation -

No

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"