This is an opportunity to join a high-growth start-up that is revolutionising automotive perception technology. With next-generation sensing technology, they are redefining the capabilities of imaging radar, delivering unprecedented resolution and performance.
Role & Responsibilities
In this role, you will lead the validation and characterization of RFICs and packages across the product lifecycle, from prototype through high-volume production at the wafer level and packaged die. You will have strong knowledge and experience in wafer-level probe tests, RF measurements, automated test development and a deep understanding of silicon validation, test hardware design, and manufacturing yield optimization.
ATE Development & Production Ramp
• Translate bench tests to automated test equipment (ATE) platforms (i.e., Advantest, Teradyne, NI).
• Develop test hardware (load boards, sockets, fixtures) and software for high-volume production.
• Reduce test time, improve yield, and ensure test coverage
Prototype Evaluation & Characterization
• Elicit test requirements from designers
• Collaborate with design and systems teams to define detailed test plans (test list, test equipment and measurement algorithms, etc.)
• Develop and execute RFIC validation tests for key performance parameters (i.e., gain, noise figure, linearity, phase noise, S-parameters).
• Use lab equipment (VNAs, spectrum analyzers, signal generators, etc.) to verify and debug new designs.
Skills & Experience
• Bachelor's degree in Electrical Engineering or an equivalent
• 10+ years of relevant experience in semiconductor ATE for RF, Analog, and Mixed Signal circuits
• Experience using electrical test instrumentation
• Experience developing high-volume automated testing for silicon wafers
• Experience in developing high-volume socket testing of silicon packages
• Ability and desire to work on rapidly paced projects with several design tasks
• Excellent interpersonal, problem-solving, and communication skills
Locations
Bay Area CA or Boston MA