iPhone Touch Electrical Engineer
Apple
2 days ago
On-site
Cupertino, California, United States
The goal of the iPhone Touch EE team is to enable the world"s best User Experiences through state-of-the-art sensing solutions. The team designs, develops, and delivers high-precision, low-latency MultiTouch solutions that are the gold standard in the smartphone/mobile industry. New challenges arise every day that require innovation across several technical disciplines, including Electrical Engineering, Manufacturing Process, Physics, and Algorithms. Come join us in delivering technology from proof-of-concept through ultra-high-volume production! Our team features a collaborative and hands-on environment that cultivates engineering excellence and creativity.
You will play a key role in designing, developing, integrating, and launching next-generation touch sensing technologies.
Perform design feasibility studies and analyses based on advanced module requirements and system constraints.\\nCollaborate with the silicon design team, the DFM team, the system team, and external suppliers to develop optimized module/system level design solutions for our touch sensing technology.\\nDefine module test and feature validation across all supply chain nodes. Drive module/system-level failure analysis, root cause diagnosis, and corrective action validation.\\nEngage partner teams to address critical issues through multiple engineering development stages to ensure a smooth product delivery.\\nBusiness travel may be required to support product development.
Strong electrical engineering background in board level circuit design.\\nHands-on experience with module/system level integration, including architecture scoping, characterization, design down-selection, and validation.\\nBS and a minimum of 10 years relevant industry experience.
Experience with high volume manufacturing of Flexible Printed Circuit Boards or microfabrication process development.\\nCircuit and FEA simulation experience (LCR extraction, signal integrity, electromagnetic coupling, etc).\\nExperience with statistical analysis of production data.\\nSchematic design and layout experience.\\nExperience with creating engineering design, requirements, and specification documents.\\nDemonstrated ownership and ability to work with cross-functional teams in a dynamic work environment.\\nExcellent written and verbal communication skills and solid teamwork.\\nAbility to thrive in ambiguity, independently resolve technical issues, and align efforts across teams.\\nPh.D. in Electrical Engineering, Microelectromechanical Engineering or equivalent experience.
You will play a key role in designing, developing, integrating, and launching next-generation touch sensing technologies.
Perform design feasibility studies and analyses based on advanced module requirements and system constraints.\\nCollaborate with the silicon design team, the DFM team, the system team, and external suppliers to develop optimized module/system level design solutions for our touch sensing technology.\\nDefine module test and feature validation across all supply chain nodes. Drive module/system-level failure analysis, root cause diagnosis, and corrective action validation.\\nEngage partner teams to address critical issues through multiple engineering development stages to ensure a smooth product delivery.\\nBusiness travel may be required to support product development.
Strong electrical engineering background in board level circuit design.\\nHands-on experience with module/system level integration, including architecture scoping, characterization, design down-selection, and validation.\\nBS and a minimum of 10 years relevant industry experience.
Experience with high volume manufacturing of Flexible Printed Circuit Boards or microfabrication process development.\\nCircuit and FEA simulation experience (LCR extraction, signal integrity, electromagnetic coupling, etc).\\nExperience with statistical analysis of production data.\\nSchematic design and layout experience.\\nExperience with creating engineering design, requirements, and specification documents.\\nDemonstrated ownership and ability to work with cross-functional teams in a dynamic work environment.\\nExcellent written and verbal communication skills and solid teamwork.\\nAbility to thrive in ambiguity, independently resolve technical issues, and align efforts across teams.\\nPh.D. in Electrical Engineering, Microelectromechanical Engineering or equivalent experience.