Electronics & Microelectronics Manufacturing Engineer
The Johns Hopkins University Applied Physics Laboratory
Full-time
On-site
Laurel, Maryland, United States
About the position
Responsibilities
• Interface with electrical and mechanical engineers to develop process plans for hardware fabrication.
• Lead the hardware development through surface mount electronics fabrication and microelectronics assembly.
• Serve as the manufacturing expert in designing and fabricating complex electronic assemblies.
• Ensure manufacturing outcomes for assigned subsystems meet sponsor's requirements.
• Design assembly workflows and adjust current workflows as necessary.
• Perform analyses to ensure hardware meets sponsor's requirements.
• Recommend new materials and processes to improve performance, quality, cost, and schedule.
• Evaluate and work with vendors as necessary.
• Generate, review, and revise standard operating procedures and process plans.
• Own the development and improvement of processes for high reliability electronic and microelectronic assemblies.
• Guide and develop fabrication technicians in assembly areas.
• Program and develop process parameters for automated electronic assembly tools and equipment.
• Assist with maintenance, calibration, and repairs of tools and equipment.
Requirements
• BS Degree or equivalent in a technical field (Electrical Engineering, Mechanical Engineering, Industrial Engineering, etc.) or equivalent experience.
• 3+ years of experience in an electronics manufacturing environment, particularly in a high mix, low volume SMT facility.
• Experience with microelectronic assemblies and providing guidance for process improvements.
• Excellent written and verbal communication skills.
• Ability to work collaboratively with partners.
• Proven process development and improvement skills with knowledge of solder joint characteristics and SMT processing tools and materials.
• Ability to manage multiple tasks simultaneously.
• Willingness to learn and improve self and processes.
• Ability to work in a Class 8 Cleanroom and travel inside the US for up to 5% of the time.
• Flexibility in work hours during periods of heavy workload.
Nice-to-haves
• Experience building electronic hardware for spacecraft.
• Experience with IPC J-STD-001FS.
• 5+ years of experience with microelectronics assemblies.
• Knowledge of statistical process control (SPC) and design of experiments (DOE).
• Exposure to manufacturing resource planning (MRP) and computer-aided manufacturing (CAM) systems.
• Basic programming skills.
• Hold an active Secret security clearance.
Benefits
• Comprehensive benefits package including retirement plans, paid time off, medical, dental, vision, life insurance, short-term disability, long-term disability, flexible spending accounts, education assistance, and training and development.
Responsibilities
• Interface with electrical and mechanical engineers to develop process plans for hardware fabrication.
• Lead the hardware development through surface mount electronics fabrication and microelectronics assembly.
• Serve as the manufacturing expert in designing and fabricating complex electronic assemblies.
• Ensure manufacturing outcomes for assigned subsystems meet sponsor's requirements.
• Design assembly workflows and adjust current workflows as necessary.
• Perform analyses to ensure hardware meets sponsor's requirements.
• Recommend new materials and processes to improve performance, quality, cost, and schedule.
• Evaluate and work with vendors as necessary.
• Generate, review, and revise standard operating procedures and process plans.
• Own the development and improvement of processes for high reliability electronic and microelectronic assemblies.
• Guide and develop fabrication technicians in assembly areas.
• Program and develop process parameters for automated electronic assembly tools and equipment.
• Assist with maintenance, calibration, and repairs of tools and equipment.
Requirements
• BS Degree or equivalent in a technical field (Electrical Engineering, Mechanical Engineering, Industrial Engineering, etc.) or equivalent experience.
• 3+ years of experience in an electronics manufacturing environment, particularly in a high mix, low volume SMT facility.
• Experience with microelectronic assemblies and providing guidance for process improvements.
• Excellent written and verbal communication skills.
• Ability to work collaboratively with partners.
• Proven process development and improvement skills with knowledge of solder joint characteristics and SMT processing tools and materials.
• Ability to manage multiple tasks simultaneously.
• Willingness to learn and improve self and processes.
• Ability to work in a Class 8 Cleanroom and travel inside the US for up to 5% of the time.
• Flexibility in work hours during periods of heavy workload.
Nice-to-haves
• Experience building electronic hardware for spacecraft.
• Experience with IPC J-STD-001FS.
• 5+ years of experience with microelectronics assemblies.
• Knowledge of statistical process control (SPC) and design of experiments (DOE).
• Exposure to manufacturing resource planning (MRP) and computer-aided manufacturing (CAM) systems.
• Basic programming skills.
• Hold an active Secret security clearance.
Benefits
• Comprehensive benefits package including retirement plans, paid time off, medical, dental, vision, life insurance, short-term disability, long-term disability, flexible spending accounts, education assistance, and training and development.